Laser Microelectronic Devices Welding Machine

Microelectronic welding machine is to seal the core components such as chips in a cavity surrounded by low permeability materials such as metal, ceramic or glass, to isolate the interference or erosion of the external environment on the chip, etc., in order to maintain the long-term reliability of the device, the device is mainly used for the packaging of various precision power devices. Such as UV-LED, MEMS, crystal oscillator, microwave devices, sensors, thick film ics, photodetectors and other products.

Model introduction

Microelectronic device laser sealing welding machine is to seal the core components such as chips in a cavity surrounded by low-permeability materials such as metal, ceramic or glass, to isolate the interference or erosion of the external environment on the chip, so as to maintain the long-term reliability of the device. The device is mainly used in the packaging of various precision power devices, such as UV-LED, MEMS, crystal oscillator, microwave devices, sensors, thick film ics, photodetectors and other products.

Model characteristics

Can achieve military grade airtight standard (548B);

High frequency laser, optical scanning welding, the efficiency is 3-5 times that of parallel sealing welding;

Extreme design optical system, minimum weld 100 microns;

Suitable for patch device board operation, material box loading and unloading, automatic welding;

Independent patent CCD visual positioning system (soft registration No. 1921278), high welding accuracy.